Detailed introduction:
IX 28215 is a two component, room temperature curing paste adhesive giving a resilient bond. It is thixotropic and non sagging up to 10mm thickness. It is particularly suitable for SMC and GRP bonding.
• Toughened paste
• Ideal for bonding GRP, SMC and dissimilar substrate
• Low shrinkage
• Gap filling, non sagging up to 10mm thickness
• High shear and peel strength
50ml/Cartridge,200ml/Cartridge
 
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